Hsiuping University of Science and Technology Institutional Repository : Item 310993100/1384

English | 正體中文 | 简体中文 | Items with full text/Total items : 4343/7642
Visitors : 3978890 Online Users : 833

RC Version 3.2 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.

Scope Adv. Search

Login ‧ Upload ‧ Help ‧ About ‧ Administer

HUSTIR > College of Engineering > Department of Electronic Engineering > Journal > Item 310993100/1384

Please use this identifier to cite or link to this item: http://ir.hust.edu.tw/dspace/handle/310993100/1384

Title:	Electroless Deposition of Ultrathin Co-B Based Barriers for Cu Metallization Using an Innovative Seeding Technique
Authors:	G. S. Chen;Y. S. Tang;S. T. Chen;J. Yang
Date:	2006
Issue Date:	2009-02-03T07:01:23Z
Relation:	Electrochemical and Solid-State Letters, 9(8), C141-C145.(SCI)
Appears in Collections:	[Department of Electronic Engineering] Journal

Files in This Item:

There are no files associated with this item.