Hsiuping University of Science and Technology Institutional Repository : Item 310993100/1417

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HUSTIR > College of Engineering > Department of Electronic Engineering > Journal > Item 310993100/1417

Please use this identifier to cite or link to this item: http://ir.hust.edu.tw/dspace/handle/310993100/1417

Title:	Self-Aligned Deposition process for ultrathin electroless barriers and copper films on low-k dielectric films
Authors:	G. S. Chen;S. T. Chen;R. F. Louh;T. J. Yang;C. K. Lin
Date:	2004
Issue Date:	2009-02-03T07:03:04Z
Relation:	Electrochem. Solid-State Lett., 7, C17－C19. (SCI)
Appears in Collections:	[Department of Electronic Engineering] Journal

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