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Please use this identifier to cite or link to this item: http://ir.hust.edu.tw/dspace/handle/310993100/1380

Title: Diffusion barrier properties of single- and multilayered quasi-amorphous tantalum nitride thin films against copper penetration
Authors: G. S. Chen;S. T. Chen
Date: 2000
Issue Date: 2009-02-03T07:01:11Z
Relation: J. Appl. Phys., 87, pp. 8473?8482. (SCI)
Appears in Collections:[Department of Electronic Engineering] Journal

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