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Collection	Date	Title	Authors
[電子工程系] 期刊論文	2013-09	無電鍍銅錳合金薄膜抑制高溫誘發團聚行為研究(Investigation of Electroless Cu-Mn Alloy to Suppress Thermal-induced Copper Agglomeration Behaviors)	陳松德; 陳錦山; 呂育霖